Website – relaunch
Maintenance and editing
PacTech – Packaging Technologies GmbH
PacTech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.
Since 2016, mcc has supported the company PacTech with all matters regarding their website. Apart from the website redesign, mcc also maintains the website, edits the website content and PacTech’s newsletter.