The German IMAPS Chapter presents the 20th European Microelectronics and Packaging Conference (EMPC) & Exhibition in Friedrichshafen at Lake Constance
Client: iMAPS Deutschland
Location: Friedrichshafen (Germany)
Size: 300 participants from 40 countries
Abstract and paper management
Conference materials design
Conference space design
From the 14th to the 16th of September 2015, the 20th European Microelectonics and Packaging Conference (EMPC) took place at Bodensee in Friedrichshafen, Germany. With over 300 participants and 45 exhibitors, the event was completely sold out.